Dry Pack
General
All SMD packed in Tape and Reel is Dry Packed. This method helps to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation from a combination of rapid moisture expansion and material mismatch.
Labels recommending the end user of storage and use conditions are located on lower level packaging.
Packing Materials/Specification
Tape and Reel is vacuumed sealed in static shield Moisture Barrier Bags (MBB) that meet MVTR, EMI/RFI requirements per MIL-B-81705. Humidity Indicator Cards (HIC) meets Mil-I-8835 and complies with MS20003-2. Desiccant Pouches meet Mil-D-3464 Type I & II.
Use / Resealing Criteria
Parts must be surface mounted within 7 days of opening sealed bags. If this time is exceeded, parts should be baked before reflow.
Baking
When baking is required, any portion of unused parts must be taken out of the reels or trays (except if they are in high-temperature trays) and placed in an oven. Bake at 125°C for 24 hours. Bake out times start when all components reach the specified temperature.
Note: Baking components may cause solder oxidation and/or intermetallic growth, which if excessive can results in solderability problems during board assembly.
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