PCA components have been designed and tested to withstand all typical Surface Mount Device (SMD) reflow processes using Infra Red (IR), Convection or a combination IR/Convection inline ovens. However, due to the various materials used in magnetic components, extreme care must be taken not to overheat or thermal stress these packages.

PCA recommends the above SMD Reflow profile and cautions that peak reflow temperatures must be kept within these guidelines to optimize success.

If there are additional questions or a need for futher technical details, please feel free to contact us at any time.