Shelf Life and Solderability
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All SMD packed in Tape and Reel are Dry Packed. This method helps avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation from a combination of rapid moisture expansion and material mismatch.

Labels recommending storage and use conditions are located on lower level packaging.

Packing Materials/Specification

Tape and Reel package products are vacuum sealed in static shield Moisture Barrier Bags (MBB) that meet MVTR, EMI/RFI requirements per MIL-B-81705. Humidity Indicator Cards (HIC) meets Mil-I-8835 and comply with MS20003-2. Desiccant Pouches meet Mil-D-3464 Type I & II.

Use/Resealing Criteria

Products or components must be surface mounted within 7 days of opening sealed bags. If this time is exceeded, parts should be baked before reflow.


When baking is required, any portion of unused products or components must be taken out of the reels or trays (except if they are in high-temperature trays) and placed in an oven. Bake at 125 °C for 24 hours. Bake out times start when all components reach the specified temperature.

Note: Baking components may cause solder oxidation and/or intermetallic growth, which if excessive, can result in solderability problems during board assembly.


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16799 Schoenborn Street
North Hills, CA 91343
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